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Selective high-speed coating system

Selektives High Speed Lackiersystem

  • Fast, accurate and detailed coating
  • Working surface up to 500 x 440 mm (410 mm in line)
  • 3 heads can be used at the same time with different materials, e.g. first valve with gel for areas that do not tolerate coating, a second valve with a wide round jet for larger areas, and a third valve for use with a fine dispensing needle.
  • Z slider with an integrated rotating and tilting function, stroke 105mm
  • In‐line drying oven with 8 independently controlled heating zones
  • Drying without air circulation through IR (infrared) heating.

DIMA 0005 coatingDIMA 0002 screen coating

Selectve high-speed coating system DR‐070

  • High speed, high accuracy
  • Camera for teach-in, reference mark identification
  • Offline programming software
  • 3 heads for use with 3 different materials concurrently
  • 4 axis movement, Z slider with a rotating and tilting function up to 105mm

Drying oven CO‐462

  • In‐line drying oven with 8 heating zones
  • Speed 3 to 1000 mm / min.

DIMA 0003 Curano Trockenofen TunnelbeginnDIMA 0004 Curano Trockenofen Heizkammer

  • Manufacturing Open or Close

    Assembly line 1 – small and medium series

    Stencil printer– SJ Inno Tech HP 520

    • PCB size: Min: 50 x 50 mm, Max: 520 x 420 mm
    • PCB thickness: 0,4 mm – 4,0 mm
    • Digital setting of squeegee pressure and speed
    • Precision 0,015 mm with repeat precision 0,01 mm
    • Minimum gap 0,03 mm, CSP 01005 (0402 metric)
    • 2D paste inspection, CCD camera, coaxial RGB-LED vision
    • Rear side cleaning: wet, vacuum, dry

    Assembly machine – Europlacer IINEO

    • PCB size: Min: 60 x 60 mm, Max: 700 x 460 mm
    • PCB thickness: 0,5 mm – 4,5 mm
    • Smallest component size 01005, lead pitch 0,4 mm
    • Centering system "On the Fly" grey scale vision, high precision 35µ (QFPs) bis 60µ (chips)
    • Turret head with 8 or 12 recording tools, assembly performance 13.500 BT/h
    • Max. number of 8 mm feeders: 264 on assembly carts + 10 Jedec Matrix Magazine
    • 40 air jet tool positions, special tools

    Reflow Oven – Heller 1707EXL

    • PCB width 50 bis 508 mm
    • Combination of linear grille and chain conveyor
    • Speed up to 60 cm / min
    • Temperature control to precisely 0,1° C
    • 3 PCB thermal element profiles
    • Process monitoring for continuous process management
    • 7 ceiling and floor heating zones, a cooling zone
    • Conveyer belt gap of 29mm at the top and bottom

    Automatic Optical Inspection – Marantz 22XDL-460

    • 2D checking of SMT and THT components
    • High Speed Digital XGA colour camera
    • DOAL (coaxial illumination system with prism), PMW LEDs
    • Gap between components top 40 mm, bottom 70 mm
    • PCB size max. 460 x 360 mm
    • Max. 160.000 components per hour, smallest component size 01005

    Assembly line 2 – medium and large series

    Stencil printer

    • Printing area: 508 x 457 mm
    • Storage of over 200.000 printing files
    • Automatic Vision System for reference corrections
    • Quatroflex clamping settings

    Assembly machine – Samsung SM 421

    • PCB size: Min: 50 x 40 mm, Max: 610 x 510 mm
    • PCB thickness: 0,38 mm – 4,2 mm
    • Smallest component size 01005 up to 75 mm connector strips
    • CCD vision system "On the Fly", high precision
    • 30µ (QFPs) to 50µ (Chips)
    • Automatic correction
    • Single X/Y-Gantry System with 6 independent heads, assembly performance 21.000 BT/h
    • Max. number of 8 mm feeders: 120 on assembly carts

    Reflow Oven – Heller 1809 MK III

    • PCB width 50 to 610 mm
    • Combination of linear grille and chain conveyor
    • Speed 60 to 80 cm / min
    • Temperature controls to precisely 0,1° C
    • Waterless and filterless flux management with self-cleaning system enables maintenance-free operation
    • 9 ceiling and floor heating zones, two cooling zones
    • Conveyer belt gap at the top and bottom 29mm

    Automatic Optical Inspection – 3K PERFORM

    • 2D testing of SMT and THT components
    • High-resolution digital camera, 2352 x 1728 pixels
    • I-Lite technology
    • Smallest component size 01005
    • PCB size max. 458 x 406 mm
    • Max. 250.000 components per hour

    Assembly line 3 – medium and large series
    The advantage of this assembly line is the use of 2 assembly machines in a row, Chip Shutter and Placer. This leads to shorter processing times on the line.

    Stencil printer Samsung SP450V

    • PCB size: Min: 50 x 50 mm, Max: 450 x 400 mm
    • Position correction through advance vision system
    • PCB print positioning with Cognex Vision System
    • Pressure regulation with a servomechanism and air cylinder
    • Cycle time 16 sec / PCB, precision 0,025 mm
    • Minimum gap 0,04 mm, CSP 01005 (0402 metric)
    • 2D measurement system for PCB and stencil
    • Fully programmable cleaning system: wet, vacuum, dry
    • Quatroflex system for quick stencil change

    Assembly machine– Samsung SM 411

    • PCB size: Min: 50 x 40 mm, Max: 610 x 460 mm; PCB thickness: 0,38 mm – 4,2 mm
    • Smallest component size 01005
    • CCD vision system "On the Fly", high precision 50µ
    • Automatic adjustment
    • 2-axes system each with 6 spindles, assembly performance 42.000 BT/h
    • Max. number of 8 mm feeders: 120 on assembly carts

    Assembly machine – Samsung SM 421

    • For technical information see assembly line 2

    Reflow Oven – Heller 1809 MK III

    • For technical information see assembly line 2

    Automatic Optical Inspection

    • For technical information see assembly line 2

    Wave soldering system – SEHO 8140PCS – Semi Nitrogen

    • With nitrogen fumigation
    • PCB size max. 350 x 400 mm
    • Spray fluxer with programmable flux dosage
    • Hot air preheating system for water-based fluxes
    • 2 IR preheating zones for optimum temperatures
    • Turbulent and laminar waves
    • Completely RoHS compatible tin solder

    Full-tunnel wave soldering system in a nitrogen atmosphere – ERSA Powerflow e N2

    • PCB size max. 400 x 500 mm
    • 3 and 5-row chip wave for efficient SMD soldering
    • Precise spray fluxer with a robust, precisely repeating driver
    • Universal finger transport or carrier transport
    • Modular, flexible preheating concept with convection heating and radiation heating also for water-based flux materials
    • Modern controls concept
    • Operation via touchscreen

    In-circuit test systems – Agilent HP3070

    • ICT testing, programming and function tests all-in-one

    High voltage tester AC/DC – GPT 9803

    • Alternating current 0,1 to 5 kV AC, 200 VA,
    • Direct current 0,1 to 6 kV DC
    • Rollover detection
    • Insulation measurements from 1 - 9990 MOhm with 50, 100, 500 or 1000 VDC

    Rework System ERSA IR550A – Selective Reflow Model

    • Suitable for BGA, fine pitch and other SMD components
    • Temperature measuring via two channels:
    • 1 IRS sensor, 1 AccuTC thermal element (K-Type)
    • Dynamic IR & Closed Loop selective reflow process
    • Laser pointer for component ID and board position
    • Manual reflow head with automatic component extraction
    • Integrated, axial, upper cooling ventilator
    • Integrated, digital soldering station with soldering irons
    • System remote control PC with process documentation

    Universal cleaning system UNICLEAN III

    • Universally usable for electronic components and precision-engineered components
    • 4-step system for small to large series with automatic rack conveyor system
    • Visualised machine regulation and process monitoring with protocols
    • Cleaning support with ultrasound or aerators
    • DI water detailed rinsing in a closed cycle (finest filter 1µ)
    • Hot air drying 80° C

    Silicon coating dispenser – Bartec

    • Automatic off-line spraying system for silicon coating
    • Coating surface 400 x 400 mm
    • User-specific programming